Mold for injection molding apparatus
US8057209B2 · kind B2 · utility
0Cited by
8References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2007 |
| Grant date | Nov 15, 2011 |
| Priority date | — |
| Expiry date | Dec 12, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2101/10
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mold for an injection molding apparatus includes a light-transmitting part forming at least a portion of the mold, and configured to transmit light to a cavity to be filled with photo-setting resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.