Ultra low melt metal nanoparticle composition for thick-film applications
US8057849B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2009 |
| Grant date | Nov 15, 2011 |
| Priority date | — |
| Expiry date | Dec 21, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/122
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of forming conductive features on a substrate, the method includes reacting a metal compound with a reducing agent in the presence of a stabilizer in a reaction mixture comprising the metal compound, the reducing agent, and the stabilizer, wherein the reaction mixture is substantially free of solvent, to form a plurality of metal nanoparticles with molecules of the stabilizer on the surface of the metal nanoparticles. After isolating the plurality of metal nanoparticles, a liquid composition that includes a polymeric binder, a liquid and the plurality of metal nanoparticles with molecules of the stabilizer on the surface of the metal nanoparticles is deposited on a substrate by a liquid deposition technique to form a deposited composition. The deposited composition is then heated to form conductive features on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.