Composition
US8058327B2 · kind B2 · utility
0Cited by
3References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 14, 2006 |
| Grant date | Nov 15, 2011 |
| Priority date | — |
| Expiry date | Oct 27, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F41/127
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The instant invention relates to highly filled epoxy resin compositions suitable as casting resins without the need of an extended curing step, to a casting process using said compositions and use of said compositions in a casting process not needing an extended curing step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.