Manufacture of novel epoxy resins semi-thermosets and their high TG thermosets for electronic applications
US8058362B2 · kind B2 · utility
1Cited by
3References
24Claims
0Family size
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Key dates
| Filing date | Feb 19, 2009 |
| Grant date | Nov 15, 2011 |
| Priority date | — |
| Expiry date | Mar 4, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0326
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An active-hydrogen-containing (carboxyl or hydroxyl) phosphorus compound is provided. An epoxy resin semi-thermoset formed by bonding the phosphorus compound to an epoxy group is also provided. A flame-retardant epoxy resin thermoset is formed after reacting the epoxy resin semi-thermoset with a curing agent. The epoxy resin thermoset possesses excellent flame retardancy, heat stability, and high glass transition temperature (Tg), does not produce toxic and corrosive fumes during combustion, and thus is an environmentally friendly flame-retardant material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.