Method and device for moving an element to be driven using an actuating element formed by etching in a semiconductor material
US8058772B2 · kind B2 · utility
1Cited by
7References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2006 |
| Grant date | Nov 15, 2011 |
| Priority date | — |
| Expiry date | Jul 2, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02N1/008
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention concerns an element to be driven, a driving element designed to be urged into engagement with the element to be driven and an actuating element adapted to move the driving element so that it drives the element to be driven in step-by-step displacement, the driving element and the actuating element being formed by etching in a semiconductor material wafer. The invention is characterized in that it comprises elastic prestressing means for maintaining the driving element in contact with the element to be driven.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.