Assembly with a printed circuit board
US8059418B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 3, 2009 |
| Grant date | Nov 15, 2011 |
| Priority date | — |
| Expiry date | May 1, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3481
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An assembly (10) comprises a housing (11) and a printed circuit board (14) received in the housing. The housing includes a housing body (12) and a cover (16). The housing body (12) has a first surface (26) supporting the printed circuit board (14) and also has a portion defining a second surface (22) receiving the cover (16). At least the portion of the housing body is formed of a material that is meltable by a laser welder. The second surface (22) is spaced from the first surface (26) by a distance that is at least as great as a thickness of the printed circuit board (14). The printed circuit board (14) is at least partially held in place by melted material from said portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.