Memory array on more than one die
US8059441B2 · kind B2 · utility
2Cited by
1References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2010 |
| Grant date | Nov 15, 2011 |
| Priority date | — |
| Expiry date | Feb 22, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
For one disclosed embodiment, an apparatus may comprise a first die including a first plurality of memory cells for a memory array and a second die including a second plurality of memory cells for the memory array. The second die may include a shared line for the memory array to conduct digital signals for memory cells of both the first and second plurality of memory cells. Other embodiments are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.