X-ray target assembly and methods for manufacturing same
US8059785B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2007 |
| Grant date | Nov 15, 2011 |
| Priority date | — |
| Expiry date | Mar 25, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2235/1204
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The x-ray target assemblies have an oxide dispersion strengthened (ODS) refractory metal alloy substrate that is bonded to a carbon-containing heat sink. The x-ray target assemblies have excellent bonding between the substrate and the heat sink. The improved bonding is achieved by placing an oxide-free barrier layer between the ODS metal substrate and the heat sink. The oxide-free barrier layer minimizes or eliminates chemical reactions that would otherwise be possible between the dispersed oxides and the carbon-based heat sink during the manufacturing process. Preventing these undesired reactions while manufacturing the x-ray target assembly yields a device with improved bonding between the heat sink and the substrate, compared to devices manufactured without the barrier layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.