Patent · US Active

Fabrication of cooling and heat transfer systems by electroforming

US8061032B2 · kind B2 · utility

9Cited by
3References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 23, 2004
Grant dateNov 22, 2011
Priority date
Expiry dateJul 3, 2028

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/4998
  • WIPO fieldThermal processes and apparatus
  • WIPO sectorMechanical engineering

Abstract

A process for fabricating a metallic component is disclosed. The process includes performing multiple electroforming steps on an object to form metallic layers. The process includes performing between the electroforming steps masking and patterning steps using a non-conductive material. The resulting metallic component has either a single layer or multiple layers of cooling or heat transfer channels, which may be at right angles in adjacent layers. The non-conductive material can be removed during the process by a solvent or by melting. The object on which the metallic component is formed may be a flat or shaped mandrel from which the metallic component can be removed. The metallic component is particularly useful in forming optical components for use in extreme ultraviolet (EUV) systems and in cooling and heat transfer systems.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.