Polishing pads including slurry and chemicals thereon and methods of fabricating the same
US8062102B2 · kind B2 · utility
16Cited by
13References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2004 |
| Grant date | Nov 22, 2011 |
| Priority date | — |
| Expiry date | Jul 15, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Polishing pads are provided that include a substrate for a polishing pad and a plurality of spaced apart members on the substrate and protruding from the substrate. The plurality of members include at least one abrasive layer and at least one chemical additive layer. Related methods of fabricating polishing pads are also provided herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.