Patent · US Active

Low-temperature impact resistant thermosetting epoxide resin compositions with solid epoxide resins

US8062468B2 · kind B2 · utility

13Cited by

30References

29Claims

0Family size

Assignee

SIKA TECHNOLOGY AG · CH

Inventors

Jurgen Finter · Glückstadt, DE
Andreas Kramer · Zürich, CH
Jan Olaf Schulenburg · Uster, CH
Urs Rheinegger · Regensdorf, CH

Key dates

Filing date	Jul 5, 2006
Grant date	Nov 22, 2011
Priority date	—
Expiry date	Jun 2, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31515
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The invention relates to compositions containing at least one solid epoxide resin A, at least one polymer B of formula (1), at least one thixotropic agent C made from a urea derivative and at least one curing agent for epoxide resins D activated by high temperatures. The compositions are particularly suitable for use as adhesives. Low-temperature impact-resistant adhesives can be produced for use in particular as structural adhesives.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.