Method for forming a hermetically sealed cavity
US8062497B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2007 |
| Grant date | Nov 22, 2011 |
| Priority date | — |
| Expiry date | Aug 8, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249953
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
One inventive aspect relates to a method for forming hermetically sealed cavities, e.g. semiconductor cavities comprising fragile devices, MEMS or NEMS devices. The method allows forming hermetically sealed cavities at a controlled atmosphere and pressure and at low temperatures, for example, at temperatures not exceeding about 200° C. The method further allows forming sealed cavities with short release times, for example, release times of about a few minutes to 30 minutes. The method may, for example, be used for zero level packaging of MEMS or NEMS devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.