Alumina taphole fill material and method for manufacturing
US8062577B2 · kind B2 · utility
0Cited by
28References
11Claims
0Family size
Assignees
Inventor
Key dates
| Filing date | Apr 10, 2009 |
| Grant date | Nov 22, 2011 |
| Priority date | — |
| Expiry date | Sep 5, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/20
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A high-temperature, heat-resistant fill material is disclosed. The high-temperature, heat-resistant fill material includes an alumina refractory waste material having one or more of a used alumina-magnesium-carbon material, a used high-alumina material and a used fused-grain alumina material is disclosed. A method for method for manufacturing a material is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.