Molecular assembly
US8063207B2 · kind B2 · utility
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Key dates
| Filing date | Sep 25, 2008 |
| Grant date | Nov 22, 2011 |
| Priority date | — |
| Expiry date | May 2, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC07F15/0066
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
A molecular assembly comprising a host metal complex with a space formed therein, and compounds having substituents enclosed in the metal complex within the space and molecular chains bonded to the substituents and extending to the exterior of the metal complex, wherein two or more substituents are enclosed in the same space of the metal complex.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.