Patent · US Active

Electronic component with wire bonds in low modulus fill encapsulant

US8063318B2 · kind B2 · utility

10Cited by

28References

18Claims

0Family size

Assignee

Silverbrook Research Pty Ltd · AU

Inventors

Susan Williams · Sydney, AU
Laval Chung-Long-Shan · Sydney, AU
Kiangkai Tankongchumruskul · Sydney, AU

Key dates

Filing date	Feb 3, 2009
Grant date	Nov 22, 2011
Priority date	—
Expiry date	Apr 17, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/20753
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic component that has a support structure with a plurality of electrical conductors, a series of wire bonds, each of the wire bonds extending from one of the electrical conductors respectively, each of the wire bonds having an end section contacting the electrical conductor and an intermediate section contiguous with the end section, a bead of dam encapsulant encapsulating the electrical conductors and the end section of each of the wire bonds, and a bead of fill encapsulant contacting the bead of dam encapsulant and encapsulating the intermediate portion of each of the wire bonds. The dam encapsulant has a higher modulus of elasticity than the fill encapsulant.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.