Patent · US Active

Housing for a semiconductor component

US8063479B2 · kind B2 · utility

0Cited by

1References

17Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Thorsten Wallisch · Stuttgart, DE
Christian Solf · Rheinstetten, DE
Florian Grabmaier · Rötteln, DE

Key dates

Filing date	Jul 20, 2009
Grant date	Nov 22, 2011
Priority date	—
Expiry date	Dec 3, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A housing for a semiconductor component, in which the housing has a plurality of pins which are provided at the edge of the housing at distances, the pins each having a width, a thickness and a length. In order to create a housing for a semiconductor component whose characteristic frequencies are outside a range in which the characteristic frequencies of the housing negatively influence the semiconductor component, either at least one of the distances lies outside the range of 1.24 mm to 1.30 mm, at least one of the widths lies outside the range of 0.33 mm to 0.51 mm, at least one of the thicknesses lies outside the range of 0.23 to 0.32 mm, or at least one of the lengths lies outside the range of 2.05 to 4.12 mm.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.