Semiconductor module and mobile apparatus
US8063846B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2007 |
| Grant date | Nov 22, 2011 |
| Priority date | — |
| Expiry date | Sep 11, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A semiconductor module includes a multilayer board, a first circuit element mounted on the multilayer board, a second circuit element stacked on the first circuit element, an interposer board, provided between the first circuit element and the second circuit element, which includes an antenna conductor, a passive element, mounted on the multilayer board, which is connected to the antenna conductor, and a molded resin layer which seals the respective elements. The antenna conductor is structured by a spiral-shaped wiring pattern and the both ends of the antenna conductor are connected to the passive element via a bonding wire. The antenna conductor functions as a loop antenna with the passive element inserted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.