Patent · US Active

Positioning wafer lenses on electronic imagers

US8063975B2 · kind B2 · utility

8Cited by

0References

33Claims

0Family size

Assignee

JABIL CIRCUIT, INC. · US

Inventors

Andrew Butterfield · Riverview, US
Sebastien Fabre · Eybens, FR
Karo Kujanpaa · Turku, FI

Key dates

Filing date	Oct 29, 2008
Grant date	Nov 22, 2011
Priority date	—
Expiry date	Feb 23, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH10F39/806
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A low cost manufacturing method (300) and assembly (100) for positioning a lens (106) relative to an electronic imager (102). A viscous adhesive (104) is applied to the lens (106) or the electronic imager (102) outside of the optical path. The lens (106) is disposed on the electronic imager (102) exclusively with the adhesive (104) disposed between them.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.