Sandwich structure with double-sided cooling and EMI shielding
US8064202B2 · kind B2 · utility
6Cited by
9References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2010 |
| Grant date | Nov 22, 2011 |
| Priority date | — |
| Expiry date | Feb 24, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49359
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A sandwich structure and method thereof is disclosed for double-sided cooling, EMI noise shielding and current carrying in mini-modules. The proposed structure comprises a top structure and a bottom structure to achieve double-sided cooling. Meanwhile, the top structure is configured to shield EMI noises as well. The proposed structure further comprises a first set of connecting structures for connecting devices of the mini-modules with the top structure and a second set of connecting structure for connecting the top structure with the bottom structure. The connecting structures are capable of carrying current.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.