Method of manufacturing printed circuit board
US8065798B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2010 |
| Grant date | Nov 29, 2011 |
| Priority date | — |
| Expiry date | Jul 22, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A fabrication method which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The method for fabricating a printed circuit board includes: providing an insulating material; forming in the insulating material at least one via-hole for interlayer electrical connection; ion beam treating the surface of the insulating material having the via-hole formed therein; forming a copper seed layer on the surface-treated insulating material using a vacuum deposition process; and plating a copper pattern on the copper seed layer to form a circuit pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.