Modular pressure sensor
US8065917B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2010 |
| Grant date | Nov 29, 2011 |
| Priority date | — |
| Expiry date | Jun 8, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/003
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor device for a modular pressure sensor package is provided, comprising a substrate having a pressure port that extends through the substrate from a first side of the substrate to a second side of the substrate. A pressure sensor die is attached to the first side of the substrate, forming a seal over the pressure port on the first side of the substrate. A cover is attached to the first side of the substrate over the pressure sensor die, forming a sealed cavity wherein the pressure sensor die is located within the cavity. The device also comprises a plurality of electrical connectors mounted to the substrate external to the cavity, the plurality of electrical connectors electrically coupled to the pressure sensor die. Further, the substrate includes at least one mounting element configured to secure a pressure port interface to the second side of the substrate in a position around the pressure port.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.