MEMS device and method for fabricating the same
US8065919B2 · kind B2 · utility
3Cited by
0References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 18, 2009 |
| Grant date | Nov 29, 2011 |
| Priority date | — |
| Expiry date | Nov 27, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49005
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A MEMS device includes: a substrate having a through hole; a first film provided on a top surface of the substrate with a bottom surface of the first film exposed in the through hole; a second film provided over the first film with an air gap interposed therebetween, and having a hole grouping including holes each in communication with the air gap; and a supporting layer interposed between the first and second films and having the air gap formed therein. Outermost holes of the hole grouping are located at regular intervals along a shape of an opening of the through hole at an upper open end.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.