System and method for thermal analysis using variable thermal resistance
US8066429B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 30, 2008 |
| Grant date | Nov 29, 2011 |
| Priority date | — |
| Expiry date | Sep 24, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K17/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal measurement apparatus and method for performing heat flux differential scanning calorimetry (DSC) is disclosed. A variable thermal resistor is used to couple a measurement assembly to a heat sink in the thermal measurement apparatus, such that samples can be rapidly heated and rapidly cooled. The apparatus can be configured with a highly conductive sample assembly enclosure. The enclosure can include a high emissivity coating. In one embodiment, the enclosure extends along a longitudinal direction that is about the same as that of an infrared lamp assembly used to heat the enclosure, thereby increasing the efficiency of heating the sample enclosure. In one configuration, the variable thermal resistor comprises a gap whose gas composition can be varied during a sample measurement to independently optimize sample heating and cooling rates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.