Finger pattern formation for thin film solar cells
US8066840B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2008 |
| Grant date | Nov 29, 2011 |
| Priority date | — |
| Expiry date | Oct 3, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming metallic connector patterns for solar cells, whereby an embosser having raised features shaped in the form of a metallic connector pattern is used to attach a portion of a metallic foil to a transparent conductive layer formed on a top transparent surface of a solar cell structure. The raised surfaces of the embosser press the metallic foil portion against the transparent conductive layer. Heat and pressure directed to the metallic foil portion attach the metallic foil portion to the underlying transparent conductive layer, and then the rest of the metallic foil, which is not attached to the transparent conductive layer, is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.