Patent · US Active

Polymer powder comprising polyamide use thereof in a moulding method and moulded body made from said polymer powder

US8066933B2 · kind B2 · utility

14Cited by

14References

31Claims

0Family size

Assignee

EVONIK DEGUSSA GMBH · DE

Inventors

Sylvia Monsheimer · Haltern am See, DE
Franz-Erich Baumann · Schneverdingen, DE
Maik Grebe · Bochum, DE
Jörg Lohmar · Dortmund, DE

Key dates

Filing date	Mar 3, 2005
Grant date	Nov 29, 2011
Priority date	—
Expiry date	Oct 15, 2026

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB33Y70/10
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

The present invention relates to a polymer powder which comprises polyamide, and to the use of this powder for shaping processes, and also to moldings produced from this polymer powder. The shaping processes are layer-by-layer processes which use powders, where regions of the respective layer are selectively melted via introduction of electromagnetic energy. The selectivity may—with no intention of restricting the invention thereto—be achieved via masks, application of inhibitors, of absorbers, or of susceptors, or via focusing of the energy introduced. After cooling, the regions then solidified can be removed in the form of moldings from the powder bed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.