Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film
US8067253B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2005 |
| Grant date | Nov 29, 2011 |
| Priority date | — |
| Expiry date | Aug 29, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An electrical device and method of making same is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a thermoplastic material capable of deforming around the chip and at least partially encasing the chip when heat and/or pressure is applied to the substrate. Electromagnetic radiation such a near infrared radiation can be used to heat the substrate. The substrate may include a compressible layer that can be compressed and/or crushed to form a recess into which the chip can be inserted. Once embedded, the chip or electrical component is secured by the substrate and may be coupled to another electrical component. A method of making an RFID transponder is also provided wherein an RFID chip is embedded in a substrate using heat and/or pressure, an antenna structure is applied to the substrate, and the RFID chip and antenna structure are coupled together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.