Radiation-emitting chip comprising at least one semiconductor body
US8067783B2 · kind B2 · utility
5Cited by
6References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 31, 2008 |
| Grant date | Nov 29, 2011 |
| Priority date | — |
| Expiry date | Jun 20, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H29/142
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip includes at least one semiconductor body having a radiation-emitting region, and at least one first contact region which is provided for making electrical contact with the semiconductor body and is spaced apart laterally from the radiation-emitting region. An electrically conductive first contact layer which is transmissive to the emitted radiation and which connects a surface of the semiconductor body, is situated on the radiation exit side of the chip to the first contact region. The surface is free of the radiation-absorbing contact structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.