Flexible on-chip datapath interface having first and second component interfaces wherein communication is determined based on a type of credit condition
US8069286B1 · kind B1 · utility
17Cited by
12References
18Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 12, 2010 |
| Grant date | Nov 29, 2011 |
| Priority date | — |
| Expiry date | Oct 12, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F15/7867
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus are provided for allowing flexible on-chip datapath interfaces on a device. Datapath connections allow data streamlining without any knowledge of channels or packet boundaries. Flexible and modular interface adapters are used to allow component designers to efficiently provide interoperable components without having to adhere to a strict datapath interface specification. Interface adapters from an adapter library are instantiated and configured automatically when two components are connected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.