Methods and apparatus for improved ejection head planarity and reduced ejection head damage
US8070259B2 · kind B2 · utility
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1References
14Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 12, 2007 |
| Grant date | Dec 6, 2011 |
| Priority date | — |
| Expiry date | Oct 5, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14362
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A micro-fluid ejection head assembly having improved assembly characteristics and methods of manufacturing a micro-fluid ejection head assembly. The micro-fluid ejection head includes a fluid supply body having at least one fluid supply port in a recessed area therein. A reinforcing member circumscribes the fluid supply port. A micro-fluid ejection head is attached with an adhesive to the supply body in the recessed area so that cracking of the ejection head during adhesive curing is substantially reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.