Hot pad assembly for pedicure
US8070788B2 · kind B2 · utility
0Cited by
0References
19Claims
0Family size
Inventor
Key dates
| Filing date | Jun 4, 2009 |
| Grant date | Dec 6, 2011 |
| Priority date | — |
| Expiry date | Jul 31, 2030 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2007/0279
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A hot pad assembly for pedicure comprises a hot pad comprising means for absorbing heat and releasing heat over a period of time, a hot pad attachment means to secure the hot pad around the knee, a hot pad cover shaped to fit and cover the hot pad having a plurality of means for securing the hot pad assembly around the shin and calf, and a leg cover for being placed between the leg and the pad cover having the hot pad therein. A beauty product is applied to the leg and the leg cover encloses the product and the leg together to improve the effectiveness of the beauty care product with the help of heat transfer from the hot pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.