Silver paste for forming conductive layers
US8070986B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2007 |
| Grant date | Dec 6, 2011 |
| Priority date | — |
| Expiry date | May 25, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/22
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a silver paste for forming electrically conductive pattern comprising 0.1 to 60 wt % of a silver C0 to C12 aliphatic carboxylate; 1 to 80 wt % of silver powder; 0.1 to 15 wt % of a binder; and a residual organic solvent.The silver paste composition according to the present invention has advantages in that it produces micro-structures of layers denser than those conventional metal pastes do; shows characteristics of a much lower electric resistance even with a relatively small thickness or a small line width, as compared with the electrically conductive pattern formed from a conventional paste; and allows heat treatment at a very low temperature even without the use of expensive nano-sized metal particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.