Methods of fabricating a polycrystalline diamond compact including a pre-sintered polycrystalline diamond table having a thermally-stable region
US8071173B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 30, 2009 |
| Grant date | Dec 6, 2011 |
| Priority date | — |
| Expiry date | Jul 14, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In an embodiment, a method of fabricating a polycrystalline diamond compact includes forming an assembly including an at least partially leached polycrystalline diamond table that includes a plurality of interstitial regions therein and a surface; at least one silicon-containing layer positioned adjacent to the surface of the at least partially leached polycrystalline diamond table; and a substrate positioned at least proximate to the at least partially leached polycrystalline diamond table. The method further includes subjecting the assembly to a high-pressure/high-temperature process; at least partially infiltrating the at least partially leached polycrystalline diamond table with the at least one silicon-containing layer, in response to the high-pressure/high-temperature process, to form an at least partially infiltrated polycrystalline diamond table that bonds to the substrate; and exposing the at least partially infiltrated polycrystalline diamond table to an acid such that at least a thermal stability thereof is enhanced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.