Low temperature ceramic microelectromechanical structures

US8071411B2 · kind B2 · utility

Assignee

• The Royal Institution for the Advancement of Learning/McGill University · CA

Inventors

• Frederic Nabki · Montréal, CA
• Mourad El-Gamal · Brossard, CA
• Tomas Dusatko · Santa Clara, US
• Srikar Vengallatore · Montréal, CA

Key dates

• Filing date: Dec 22, 2008
• Grant date: Dec 6, 2011
• Expiry date: Dec 22, 2028

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/0735
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A method of providing microelectromechanical structures (MEMS) that are compatible with silicon CMOS electronics is provided. The method provides for processing and manufacturing is steps limiting a maximum exposure of an integrated circuit upon which the MEMS is manufactured during MEMS manufacturing to below a temperature wherein CMOS circuitry is adversely affected, for example below 400° C., and sometimes to below 300° C. or 250° C., thereby allowing direct manufacturing of the MEMS devices onto electronic integrated circuits, such as Si CMOS circuits.