Overmolded semiconductor package with a wirebond cage for EMI shielding

US8071431B2 · kind B2 · utility

Assignee

• Skyworks Solutions, Inc. · US

Inventors

• Dinphuoc V. Hoang · Westminster, US
• Thomas E. Noll · Derry, US
• Anil Agarwal · North Potomac, US
• Robert W. Warren · Newport Beach, US
• Matthew Sean Read · Rancho Santa Margarita, US
• Anthony James LoBianco · Irvine, US

Key dates

• Filing date: Dec 16, 2010
• Grant date: Dec 6, 2011
• Expiry date: Dec 16, 2030

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49126
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.