Silicon nitride body and method of manufacture
US8071495B2 · kind B2 · utility
3Cited by
23References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2007 |
| Grant date | Dec 6, 2011 |
| Priority date | — |
| Expiry date | Mar 13, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2235/96
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A densified silicon nitride body can be formed using a lanthana-based sintering aid. The composition may exhibit properties that provide a material useful in a variety of applications that can benefit from improved wear characteristics. The composition may be densified by sintering and hot isostatic pressing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.