Printed circuit board
US8071885B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2008 |
| Grant date | Dec 6, 2011 |
| Priority date | — |
| Expiry date | Aug 7, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09263
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes a base insulating layer and a conductor pattern provided on the base insulating layer. The conductor pattern includes a line portion linearly extending along a virtual axis line in a line region, a first bend portion extending along the axis line while being bent in a convex shape toward one side of the base insulating layer in a first bend region, and a second bend portion extending along the axis line while being bent in a convex shape toward the other side of the base insulating layer in a second bend region. The conductor pattern is formed such that the first bend portion and the second bend portion do not overlap with each other in a vertical direction when the printed circuit board is folded along a boundary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.