Printed circuit board and method for manufacturing same
US8071887B2 · kind B2 · utility
1Cited by
2References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 17, 2008 |
| Grant date | Dec 6, 2011 |
| Priority date | — |
| Expiry date | Apr 5, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/32
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes a substrate having a surface, a circuit layer having a plurality of electrical traces formed on the surface, and an electrically conductive metal layer formed on the circuit layer. The circuit layer is comprised of a composite of carbon nano-tubes and metallic nano-particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.