LED with light transmissive heat sink
US8071997B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2006 |
| Grant date | Dec 6, 2011 |
| Priority date | — |
| Expiry date | Oct 6, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An more efficient or higher luminance LED assembly may be formed from a high power LED chip having a first surface, and a second surface, the first surface being mounted to a substrate; the second surface being in intimate thermal contact with a light transmissive heat sink having a thermal conductivity greater than 30 watts per meter-Kelvin. The LED chip is otherwise in electrical contact with at least a first electrical connection and a second electrical connection for powering the LED chip. Providing light transmissive heat sink can double the heat conduction from the LED dies thereby increasing life, or efficiency or luminance or a balance of the three.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.