LED lamp module and fabrication method thereof
US8072063B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 2009 |
| Grant date | Dec 6, 2011 |
| Priority date | — |
| Expiry date | Nov 5, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/182
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An LED lamp module includes a heat sink element having one-piece form; a circuit substrate affixed onto the heat sink element, wherein the substrate has at least an opening exposing the heat sink element, and has an area smaller than that of the heat sink element; a plurality of LED chips mounted on the exposed portion of the heat sink element and electrically connected to the circuit substrate; and a light transparent package material, encapsulating the plurality of LED chips, wherein the heat sink element includes a uniform temperature plate or a plate including at least a vacuum cavity, and an extension part extending laterally from the plate and turned to surround the plurality of LED chips, forming a secondary optical structure. A fabrication method for the LED lamp module is also disclosed. Existing fabrication process is simplified and the cost is lowered with increased heat dissipation effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.