Patent · US Active

System and method for integrated waveguide packaging

US8072065B2 · kind B2 · utility

4Cited by

3References

10Claims

0Family size

Assignee

VIASAT, INC. · US

Inventors

Noel Lopez · Chandler, US
Michael R. Lyons · Gilbert, US
Dave Laidig · Mesa, US
Kenneth V. Buer · Gilbert, US

Key dates

Filing date	Feb 14, 2008
Grant date	Dec 6, 2011
Priority date	—
Expiry date	Apr 19, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10189
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A millimeter wave system or package may include at least one printed wiring board (PWB), at least one integrated waveguide interface, and at least one monolithic microwave integrated circuit (MMIC). The package may be assembled in panel form incorporating parallel manufacturing techniques.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.