Chip-type protection device having enclosed micro-gap between electrodes
US8072730B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2009 |
| Grant date | Dec 6, 2011 |
| Priority date | — |
| Expiry date | Dec 24, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01T4/08
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a chip-type protection device having an enclosed micro-gap between electrodes. The invention includes a substrate on which a pair of discharge electrodes extend towards each other by a micro-gap. A wall is disposed in a manner spaced apart from the micro-gaps by a predetermined distance, on which a cover portion is mounted in a straddling manner across the micro-gaps. The wall and the cover portion are integrated under a predetermined gaseous environment to form a hermectic chamber on which an outer protective layer is coated. End electrodes are subsequently formed on the substrate in a manner connected to conductive portions of the discharge electrodes. The invention provides a protection device against over-voltage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.