Capacitor and wiring board including the capacitor
US8072732B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2008 |
| Grant date | Dec 6, 2011 |
| Priority date | — |
| Expiry date | Oct 6, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10712
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A capacitor is provided having a tough surface portion which prevents cracking that tends to occur when the capacitor is built-in or surface-mounted on a wiring board. A ceramic sintered body of the capacitor includes a capacitor forming layer portion, a cover layer portion and an interlayer portion. The capacitor forming layer portion has a laminated structure wherein ceramic dielectric layers and inner electrodes connected to a peripheral portion of capacitor via conductors, are alternately laminated. The cover layer portion is exposed at a surface portion of the ceramic body and has a laminated structure wherein ceramic dielectric layers and dummy electrodes not connected to the capacitor via conductors, are alternately laminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.