Printed circuit board assembly
US8072762B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 28, 2010 |
| Grant date | Dec 6, 2011 |
| Priority date | — |
| Expiry date | May 12, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed circuit board assembly includes a printed circuit board, a first heat dissipating module, and a second heat dissipating module. The printed circuit board includes a first heat generating element and a second heat generating element. The first heat dissipating module is disposed on the first heat generating element. The first heat dissipating module includes a heat sink and a first heat pipe. The first heat pipe includes a pipe body and an extending portion extending from the pipe body. The second heat dissipating module is disposed on the second heat generating element. The pipe body is connected to the heat sink and the extending portion is connected to the second heat dissipating module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.