Printed circuit board assembly
US8072763B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 22, 2010 |
| Grant date | Dec 6, 2011 |
| Priority date | — |
| Expiry date | May 12, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0271
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed circuit board assembly includes a heat sink, a back board, and a securing member. The heat sink is configured to be mounted on a heat generating element of a printed circuit board. The heat sink is configured to dissipate heat generated by the heat generating element. The heat sink and the back board are configured to be placed on opposite sides of the printed circuit board. The heat sink includes a first connecting heat pipe. The back board includes a second connecting heat pipe. The second connecting heat pipe contacts the first connecting heat pipe. The securing member thermally contacts the first connecting heat pipe and the second connecting heat pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.