Multi-part substrate assemblies for low profile portable electronic devices
US8072764B2 · kind B2 · utility
10Cited by
5References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2009 |
| Grant date | Dec 6, 2011 |
| Priority date | — |
| Expiry date | Jun 4, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Multi-part substrate arrangements that yield low profile configurations are disclosed. One aspect pertains to portable electronic devices are able to have low profiles through use of multi-part substrate arrangements. Another aspect pertains to methods for assembling two or more separate substrates into a multi-part substrate. By use of multi-part substrate arrangements according to the invention, portable electronic devices are able to be thinner and more compact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.