MEMS microphone package with RF insensitive MEMS microphone chip
US8073179B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2008 |
| Grant date | Dec 6, 2011 |
| Priority date | — |
| Expiry date | Oct 6, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A micro-electro-mechanical-system microphone package includes a substrate, a micro-electro-mechanical-system microphone chip mounted on the substrate, and a cover attached to the substrate to cover the micro-electro-mechanical-system microphone chip. The cover is provided with a sound inlet through which the micro-electro-mechanical-system microphone receives external sound. The micro-electro-mechanical-system microphone chip includes a conductive base connected to a constant voltage, a shielding layer supported by the conductive base and connected to the constant voltage, a diaphragm disposed between the conductive base and the shielding layer, and a back plate also disposed between the conductive base and the shielding layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.