Liquid ejection head
US8075107B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2009 |
| Grant date | Dec 13, 2011 |
| Priority date | — |
| Expiry date | Dec 17, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1646
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Provided is a liquid ejection head having a structure in which an organic resinous member is formed in contact with a substrate. The substrate includes heat generators for generating heat energy used to eject ink, when being energized, and a metallic line portion for energizing the heat generators. The organic resinous member is provided with ejection openings corresponding to the heat generators. In the liquid ejection head, the substrate and the organic resinous member have an improved adhesion therebetween, and are prevented from being separated from each other. To improve the adhesion, the metallic line portion is cut so that no line portion exists under an end part of the organic resinous member (nozzle formation member). Then, two members of the line portion thus cut are connected to each other through a roundabout line formed under an insulating layer which has a good adhesion to the organic resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.