Particle removal method and composition
US8075697B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 7, 2008 |
| Grant date | Dec 13, 2011 |
| Priority date | — |
| Expiry date | Feb 7, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/46
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and cleaning solution for cleaning electronic substrates, such as a semiconductor wafers, hard disks, photomasks or imprint molds. The method comprises the steps of contacting a surface of the substrate with a cleaning solution comprised of a polyphosphate, and then removing the cleaning solution from the surface. Additional optional steps include applying acoustic energy to the cleaning solution while the cleaning solution is in contact with the surface, and removing the cleaning solution from the surface by rinsing the surface with a rinsing solution with or without the application of acoustic energy. The cleaning solution comprises a polyphosphate, such as any of the water soluble polyphosphates. Depending on the application, the cleaning solution may also comprise a base and/or a quantity of suspended particles. Complexing agents, amines, biocides, surfactants and/or other substances, may also be added to the cleaning solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.