Self-assembly of micro-structures
US8076178B2 · kind B2 · utility
17Cited by
1References
20Claims
0Family size
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Key dates
| Filing date | Sep 28, 2007 |
| Grant date | Dec 13, 2011 |
| Priority date | — |
| Expiry date | Oct 9, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of a method for assembling a multi-chip module (MCM) are described. During this method, a fluid that includes coupling elements is applied to a surface of a base plate in the MCM. Then, at least some of the coupling elements are positioned into negative features on the surface of the base plate using fluidic assembly. Note that a given coupling element selects a given negative feature using chemical-based selection and/or geometry-based selection. Next, the fluid and excess coupling elements (which reside in regions outside of the negative features on the surface) are removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.