Coextrudable hot-melt adhesive

US8076422B2 · kind B2 · utility

Assignee

• Henkel AG & Co. KGaA · DE

Inventors

• Marcus Heemann · Goldkronach, DE
• Eckhard Purkner · Düsseldorf, DE
• Volker Erb · Goldkronach, DE
• Maja Schroeder · Ratingen, DE
• Dirk Vianden · Mülheim an der Ruhr, DE

Key dates

• Filing date: Jun 11, 2010
• Grant date: Dec 13, 2011
• Expiry date: Jun 11, 2030

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L2314/06
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A hot-melt adhesive for resealable packaging, containing 30 to 90 wt. % of at least one copolymer based on ethylene and/or propylene together with C4 to C12-α-olefins, which is obtainable by metallocene-catalyzed polymerization, with a melt index of 5 to 100 g/10 min (DIN ISO 1133), 5 to 50 wt. % of tackifier resins with a softening point of 80 to 140° C., 0 to 15 wt. % of waxes with a melting point of 120 to 170° C., 0.1 to 20 wt. % of additives and auxiliaries, the adhesive having a viscosity of 25,000 mPa·s to 250,000 mPa·s, measured at a temperature of 170 to 190° C.